Deeply explore industrial gas solutions! Chinllenge New energy shares ways to reduce costs and increase efficiency

Our country is a major country in electronic components. Theoutput of a variety of electronic ceramic products ranks first in the world. Ithas formed a number of internationally competitive component product productionbases and has the world's largest application market. However, at present, thehigh-end electronic ceramic materials market is mainly monopolized by Japanesecompanies. A small part of the domestically produced materials are used inhigh-end component products, and most of them are used in low-end and mid-endcomponent products. Domestic high-level scientific research results encounterbottlenecks from raw materials, production equipment, stability, etc., accountfor a relatively low market share, and the electronic ceramic industry is largebut not strong. In this context, Chinllenge New Energy Tech (Shanghai) Co., Ltdparticipated in the "4th Electronic Ceramics (LTCC/HTCC/MLCC) IndustryForum" hosted by Aibang Intelligent Manufacturing in Hefei, Anhui Provinceon July 3, 2025. The theme of this seminar centered on the material researchand development, process manufacturing and other aspects of electronic ceramicsLTCC/HTCC/MLCC. Minister Li of the Ministry of Development delivered thekeynote speech on "High-purity Nitrogen Gas Reduction and EfficiencyIncrease in the Electronics Industry" on behalf of the company.

1. Conference background

Electronic ceramics refer to a class of advanced ceramic materialsthat have unique electrical, optical, magnetic and other properties and play akey role in the fields of electronics, communications, automation, energyconversion and storage. As an important type of strategic new materials,electronic ceramics are the core materials of passive electronic components andan important technological frontier in the field of electronic informationtechnology. As electronic information technology becomes increasinglyintegrated, intelligent and miniaturized, passive electronic components haveincreasingly become the bottleneck in the development of electronic componenttechnology, and the strategic position of electronic ceramic materials andtheir preparation and processing technology has become increasingly prominent.

2. SCGC speech theme

1. Tailor-made gas solutions

Based on the gas consumption characteristics of the electronicceramics industry, SCGC conducted a comparative analysis of the advantages anddisadvantages of using liquid nitrogen and on-site gas supply models to findthe opportunity cost points of liquid nitrogen users.

2. Help nitrogen reduce costs and increase efficiency

Through the analysis of the characteristics of low-temperaturecryogenic nitrogen production, the points of cost reduction and efficiencyimprovement in the production process were found.

3. Our technical characteristics and advantages

Chinllenge New Energy has more than 20 years of consulting,planning, design, complete integration, safety compliance, installation anddebugging, production operations and maintenance focusing on an industrial gassolution. Relying on independent intellectual property rights developed byitself, it owns more than 20 inventions and utility model patents, as well asmore than 30 software copyrights. Relying on practical experience in productionoperations, a global digital operation center has been established to provideon-site unattended and remotely monitored operation management for gasproduction plants across the country and abroad.

4. Introduction to Chinllenge New Energy Company

SCGC Group was founded in 2001 and is headquartered in Pudong NewDistrict, Shanghai City. It is a professional gas company with a China brand.The company's business covers all over the country and abroad. It has investedin the construction of nearly 100 sets of industrial gas production and gassupply units, providing enterprises with on-site gas production, centralizedgas supply from the park pipe network, EPC complete sets of equipment,equipment leasing, operation management, energy contract management and otherservices. Over the past 20 years of professional experience, we have providedon-site gas generation services to corporate users in many industries such ascopper processing, electronics, shipbuilding, float glass, photovoltaics,lithium batteries, daily glass, metal sheet, and new materials.

3. Professional knowledge ofelectronic ceramics

The main application area of electronic ceramics is passiveelectronic components. Chip multilayer ceramic capacitors (MLCC) are currentlyone of the most widely used and fastest-growing passive components. They are animportant part of the field of electronic components and are known as"industrial rice". MLCC has the characteristics of high reliability,high precision, high integration, low power consumption, large capacity, smallsize and low cost. It plays the roles of decoupling, coupling, filtering,bypassing and resonance. Its application fields include automotive electronics,consumer electronics, communications, new energy, industrial control and otherindustries. Its mainstream development trend is miniaturization, largecapacity, thin layer, base metal, and high reliability. Among them, thetechnology related to base metallization of internal electrodes has developedmost rapidly in recent years. Using base metal internal electrodes is the mosteffective way to reduce the cost of MLCC, and the key technology to achievebase metallization is the development of high-performance anti-reducing bariumtitanate ceramics. In recent years, domestic and foreign manufacturers haveshifted to high-value added high-end MLCC markets such as miniaturization, highcapacity and high reliability, and the industry competition mechanism hasshifted to quality competition.

Passive integration technology based on Low Temperature Co-firedCeramic Technology (LTCC) technology has broad development space. With itsexcellent electrical, thermal, mechanical and interconnection characteristics,LTCC technology has become the preferred method for miniaturization,integration, multifunction and system-level packaging of the new generation ofpassive devices. It is widely used in various microelectronic device fields,such as high-precision chip components, passive integrated functional devices,passive integrated substrates and microelectronic functional modules. In recentyears, the emergence of emerging technologies such as 5G/6G mobilecommunications, virtual reality, and artificial intelligence has brought newopportunities to the development of LTCC. To achieve the integration andmodularization of passive components, new LTCC material systems must bedeveloped, and the problem of co-firing compatibility between materials withdifferent dielectric constants and with metal electrodes must be solved.

As one of the core technologies of advanced electronic packagingand substrate materials, high temperature co-fired ceramic (HTCC) technology isthe cornerstone supporting the development of high-power, high-frequency, andhigh-reliability electronic devices. HTCC uses high-performance ceramicmaterial systems such as aluminum oxide, aluminum nitride, and silicon carbideto achieve integrated formation of multi-layer structures throughhigh-temperature sintering processes. It has excellent thermal stability,mechanical strength, high-frequency dielectric properties and extremeenvironmental resistance. It plays an irreplaceable role in aerospace,automotive electronics, power semiconductors, optical communications, nuclearenergy and other fields. Its technical characteristics are reflected in highthermal conductivity, low thermal expansion coefficient, high insulationstrength and compatibility with high-temperature semiconductor materials (suchas silicon carbide and gallium nitride), making it a 5G/6G communication basestation, third-generation semiconductor device, and high-density packaging Akey technology carrier for high-end applications such as substrates.

Currently, globalelectronic devices are evolving towards high power density, high integrationand intelligence. Coupled with the surge in demand for extreme environmentalreliability in new energy, smart grid, aerospace and other fields, HTCCtechnology is ushering in a new round of development opportunities. Innovationin material systems has become the core driving force: on the one hand, thelarge-scale application of low dielectric and high thermal conductivityceramics such as aluminum nitride (AlN) and silicon nitride (Si3N4) hasaccelerated; on the other hand, multi-layer HTCC and LTCC, DBC (Heterogeneousintegration technologies such as direct bonded copper) promote system-levelpackaging innovation. However, HTCC still faces the problem of collaborativeoptimization of materials, process and properties, such as bottlenecks such aspreparation of high-purity ceramic powders, low-temperature sintering densificationtechnology, and improvement of reliability of multi-layer structural interfacesthat need to be broken. In addition, with the penetration of third-generationsemiconductor devices into vehicle specification and aerospace applications,HTCC's strategic position in thermal management, electrical connection andpackaging integration has been further highlighted.